Heat dissipation module

ABSTRACT

A heat dissipation module includes a first substrate, a second substrate spaced from the first substrate, a heat pipe and three resilient flakes, i.e., a first resilient flake, a second resilient flake and a third resilient flake. The heat pipe connects with the first and second substrates. The first resilient flake forms a securing portion connecting with the first substrate and a locking portion extending outwardly beyond an outer edge of the first substrate. The second resilient flake forms a securing portion connecting with the second substrate and a locking portion extending outwardly beyond an outer edge of the second substrate. The third resilient flake includes a locking portion located at a middle and two securing portion at two opposite ends thereof. The two securing portions of the third resilient flake connect with the first and second substrates, respectively.

BACKGROUND

1. Technical Field

The present disclosure relates to heat dissipation, and particularly toa heat dissipation module for use in an electrical device which has alow profile.

2. Description of Related Art

With continuing development of electronic technology, heat-generatingelectronic components such as CPUs (central processing units) aregenerating more and more heat which requires immediate dissipation,especially in electronic devices which do not have enough space therein.Generally, a heat dissipation module is attached to the CPU to providesuch heat dissipation. A conventional heat dissipation module includes arectangular substrate for absorbing heat from the CPU, a fin unit and aheat pipe thermally connected the substrate to the fin unit. Four fixingarms extend outwardly from four corners of the substrate, respectively.Each of the fixing arms defines a through hole at a distal end thereof.In use of the heat dissipation module, four screws respectively extendsthrough the through hole of the fixing arms and engages into a PCB(printed circuit board) on which the CPU is mounted, for maintaining acontact between the CPU and the heat dissipation module.

However, with the computers getting more and more compact, usually aheat dissipation module is used to dissipate heat for two electroniccomponents such as a CPU and a GPU (Graphic Processing Unit)simultaneously. Thus, the heat dissipation module may have twosubstrates separated from each other for contacting the CPU and the GPU,respectively. Each substrate needs four fixing arms to secure thesubstrate on the PCB, which increases a size of the substrates and amanufacturing cost of the substrates. Furthermore, the PCB should definea lot of mounting holes corresponding to the through holes of the fixingarms, which greatly reduces a mechanical intensity of the PCB. Moreover,the process for mounting the heat dissipation module to the PCB istime-consuming and inconvenient.

For the foregoing reasons, therefore, there is a need in the art for aheat dissipation module which overcomes the above-mentioned problems.

BRIEF DESCRIPTION OF THE DRAWING

Many aspects of the embodiments can be better understood with referencesto the following drawing. The components in the drawing are notnecessarily drawn to scale, the emphasis instead being placed uponclearly illustrating the principles of the present heat dissipationmodule.

The only FIGURE is an assembled, isometric view of a heat dissipationmodule in accordance with an exemplary embodiment of this disclosure.

DETAILED DESCRIPTION

The only FIGURE shows a heat dissipation module 100 in accordance withan exemplary embodiment of the present disclosure for dissipating heatfrom two electronic components (not shown) mounted on a PCB (not shown).The two electronic components may include a CPU and a GPU. The heatdissipation module 100 includes a fin unit 10, a first substrate 20, asecond substrate 30 spaced from the first substrate 20, a heat pipe 40thermally connecting the fin unit 10 with the first and secondsubstrates 20, 30, and three resilient flakes, i.e., a first resilientflake 50, a second resilient flake 60 and a third resilient flake 70 formounting the first and second substrates 20, 30 to the PCB.

The heat pipe 40 is flat and elongated. The heat pipe 40 includes anevaporator section 41, a condenser section 42 and an adiabatic section43 located between the evaporator section 41 and the condenser section42. Each of the evaporator section 41 and the condenser section 42 islinearly shaped. The condenser section 42 is parallel to and locatedhigher than the evaporator section 41. The adiabatic section 43 extendsdownwardly and slantwise from one end of the condenser section 42towards the evaporator section 41. The adiabatic section 43 includes anupper end connected with the condenser section 42 and a lower endconnected with the evaporator section 41.

The first and second substrates 20, 30 each are substantiallyrectangular, and in parallel with each other. Each of the substrates 20,30 includes a top surface (not labeled) and a planar bottom surface 24,34 opposite to the top surface for closely contacting the correspondingelectronic component. A first receiving groove 21 is defined in the topsurface of the first substrate 20 and near and parallel to a rear sideof the first substrate 20. A first protruding rib 22 extends upwardlyand perpendicularly from the top surface of the first substrate 20. Thefirst protruding rib 22 is located at one side of the first receivinggroove 21 that is away from the rear side of the first substrate 20. Asecond receiving groove 33 collinear to the first receiving groove 21 isdefined in the top surface of the second substrate 30, adjacent to arear side of the second substrate 30. Each of the first and secondreceiving grooves 21, 33 is substantially rectangular, and has a sizeand a shape corresponding to the evaporator section 41 of the heat pipe40 for receiving the evaporator section 41 therein. A second protrudingrib 31 and a third protruding rib 32 extend upwardly and perpendicularlyfrom the top surface of the second substrate 30 at two opposite sides ofthe second receiving groove 33, respectively. The second protruding rib31 is parallel to the third protruding rib 32, and located at the rearside of the second substrate 30. The third protruding rib 32 iscollinear to the first protruding rib 22 of the first substrate 20.

The first resilient flake 50 is flat and V-shaped. The first resilientflake 50 includes a linear securing portion 51 connected with the firstsubstrate 20 and an elongated locking portion 52 extending horizontallyand slantwise from one end of the securing portion 51 to protrude out ofthe first substrate 20. The securing portion 51 of the first resilientflake 50 is located on the top surface of the first substrate 20, and isparallel to the first protruding rib 22. The securing portion 51 of thefirst resilient flake 50 is arranged between one side of the evaporatorsection 41 of the heat pipe 40 and the rear side of the first substrate20, and extends along the rear side of the first substrate 20. Thelocking portion 52 defines a through hole 721 at a distal end away fromthe securing portion 51 thereof. The securing portion 51 defines twomounting holes 711 at two opposite ends thereof, respectively.

The second resilient flake 60 is flat and linearly shaped. The secondresilient flake 60 includes a linear securing portion 61 connected withthe second substrate 60 and a locking portion 62 extending linearly fromone end of the securing portion 61 beyond a right edge of the secondsubstrate 30. The second resilient flake 60 is mounted on the topsurface of the second substrate 30, and located at another side of theevaporator section 41 of the heat pipe 40 that is away from the rearside of the second substrate 30. Similarly, the locking portion 62defines a through hole 721 at a distal end thereof and the securingportion 61 defines two mounting holes 711 therein.

The third resilient flake 70 includes a locking portion 72, two securingportions 71 and two arched portions 73. The locking portion 72 islocated at a middle of the third resilient flake 70. The two securingportions 71 are located at two opposite ends of the third resilientflake 70, respectively. The two arched portions 73 each connect one endof the locking portion 72 to a corresponding securing portion 71. Thelocking portion 72 and the securing portions 71 of the third resilientflake 70 are coplanar and collinear. The arched portions 73 eachprotrude upwardly with respect to the locking portion 72 and thesecuring portions 71. The third resilient flake 70 is mounted on the topsurfaces of the first and second substrates 20, 30, and located adjacentto a front lateral side of the first and second substrates 20, 30. Thelocking portion 72 of the third resilient flake 70 is located betweenthe first and second substrates 20, 30 and spaced from the first andsecond substrates 20, 30. The securing portions 71 of the thirdresilient flake 70 are located on the top surfaces of the first andsecond substrates 20, 30, respectively. Each of the securing portions 71of the third resilient flakes 70 defines two mounting holes 711 therein.The locking portion 72 of the resilient flakes 70 defines a through hole721 therein.

The fin unit 10 is substantially rectangular. The fin unit 10 is locatedadjacent to the first substrate 20. The fin unit 10 defines an elongatedslot at an upper portion for extension of the condenser section 42 ofthe heat pipe 40 therein.

In assembly of the heat dissipation module 100, the condenser section 42of the heat pipe 40 is received in the slot of the fin unit 10 andconnected thereto via soldering. The evaporator section 41 of the heatpipe 40 is located on the top surfaces of the first and secondsubstrates 20, 30 and received in the first and second receiving grooves21, 33. The protruding ribs 22, 32, 31 abut against two opposite sidesof the evaporator section 41, respectively. Fasteners such as screws(not shown) are provided to extend through the mounting holes 711 of thesecuring portions 51, 61, 71 of the resilient flakes 50, 60, 70 andengage into holes defined in the substrates 20, 30 to attach theresilient flakes 50, 60, 70 to the first and second substrates 20, 30,respectively. In assembling the heat dissipation module 100 to theelectronic components on the PCB, another plurality of screws areprovided to extend through the through holes 721 of the locking portions52, 62, 72 of the resilient flakes 50, 60, 70 and engage into the PCB,to thereby connect the first, second and third resilient flakes 50, 60,70 to the PCB. Thus, the first and second substrates 20, 30 of the heatdissipation module 100 are respectively attached to the electroniccomponents on the PCB.

As described above, the heat dissipation module 100 only uses threeresilient flakes 50, 60, 70 for mounting, and each of the resilientflakes 50, 60, 70 only needs one screw for connecting with the PCB; thusthe cost of the heat dissipation module 100 is relatively low, andassembly of the heat dissipation module 100 to the PCB is simple andquick. In addition, the PCB only defines three mounting holescorresponding to the mounting holes 721 of the locking portions 52, 62,72 of the resilient flakes 50, 60, 70, which reduces a risk of damage ofthe PCB and improves the easiness in designing the layout of the PCB.Furthermore, since the locking portion 72 is located amid the securingportions 71 which are connected to the first and second substrates 20,30, respectively, the force exerted on the locking portion 72 isuniformly distributed to the first and second substrates 20, 30, wherebythe first and second substrate 20, 30 each can engage with thecorresponding electronic component with a substantially equal normalforce. Moreover, when the locking portion 72 of the third resilientflake 70 is pressed downwardly, the arched portions 73 generatedeformation to provide elastic force to press the first and secondsubstrates 20, 30 downwardly, thereby ensuring the first and secondsubstrates 20, 30 to have intimate engagements with the electroniccomponents.

It is to be understood, however, that even though numerouscharacteristics and advantages of the disclosure have been set forth inthe foregoing description, together with details of the structure andfunction of the embodiments, the disclosure is illustrative only, andchanges may be made in detail, especially in matters of shape, size, andarrangement of parts within the principles of the invention to the fullextent indicated by the broad general meaning of the terms in which theappended claims are expressed.

1. A heat dissipation module, comprising: a first substrate and a secondsubstrate being spaced from each other; a heat pipe thermally connectingwith the first substrate and the second substrate; a first resilientflake forming a securing portion connecting with the first substrate anda locking portion extending outwardly beyond an outer edge of the firstsubstrate; a second resilient flake forming a securing portionconnecting with the second substrate and a locking portion extendingoutwardly beyond an outer edge of the second substrate; and a thirdresilient flake comprising a locking portion being located at a middlethereof and two securing portions at two opposite ends thereof, the twosecuring portions of the third resilient flake connecting with the firstand second substrates, respectively.
 2. The heat dissipation module ofclaim 1, wherein the heat pipe includes a condenser section and anopposite evaporator section connecting with the first and secondsubstrates, two of the three resilient flakes are located at twoopposite lateral sides of the evaporator section of the heat pipe. 3.The heat dissipation module of claim 2, wherein the first resilientflake is located at one lateral side of the evaporator section of theheat pipe, while the second resilient flake is located at an oppositelateral side of the evaporator section of the heat pipe.
 4. The heatdissipation module of claim 3, wherein the first and second substratesare substantially rectangular, the evaporator section of the heat pipeis located on top surfaces of the first and the second substratesadjacent to sides of the first and second substrates.
 5. The heatdissipation module of claim 1, wherein the third resilient flake formsan arched portion between each of the securing portions and the lockingportion, the arched portion connects one end of the locking portion witha corresponding securing portion of the third resilient flake.
 6. Theheat dissipation module of claim 5, wherein the locking portion and thesecuring portions of the third resilient flake are coplanar andcollinear, the arched portions protrude upwardly with respect to thesecuring portions and the locking portion of the third resilient flake.7. The heat dissipation module of claim 1, wherein the first and secondsubstrates are in parallel with each other.
 8. The heat dissipationmodule of claim 7, wherein the third resilient flake is located at afront side of the first and second substrates, and the first and secondresilient flakes are located at rear sides of the first and secondsubstrates, respectively.
 9. The heat dissipation module of claim 8,wherein the third resilient flake forms two arched portions eachconnecting one end of the locking portion to a corresponding securingportion of the third resilient flake.
 10. A heat dissipation module,comprising: a first substrate and a second substrate being spaced fromeach other; a fin unit; a heat pipe forming an evaporator sectionconnecting with the first substrate and the second substrate, and acondenser section connecting with the fin unit; a first resilient flakeforming a securing portion connecting with the first substrate and alocking portion extending outwardly beyond an outer edge of the firstsubstrate; a second resilient flake forming a securing portionconnecting with the second substrate and a locking portion extendingoutwardly beyond an outer edge of the second substrate; and a thirdresilient flake comprising a locking portion being located at a middlethereof and two securing portions at two opposite ends thereof, the twosecuring portions of the third resilient flake connecting with the firstand second substrates, respectively.
 11. The heat dissipation module ofclaim 10, wherein the first resilient flake is located at one lateralside of the evaporator section of the heat pipe, while the secondresilient flake is located at an opposite lateral side of the evaporatorsection of the heat pipe.
 12. The heat dissipation module of claim 11,wherein the first and second substrates are substantially rectangular,the evaporator section of the heat pipe is located on top surfaces ofthe first and the second substrates adjacent to sides of the first andsecond substrates.
 13. The heat dissipation module of claim 10, whereinthe third resilient flake forms two arched portions each connecting oneend of the locking portion to a corresponding securing portion of thethird resilient flake.